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Re-killing the "material rivers and lakes" Why does this glue company dare to "speak" and rank among the top three in China within three years?
The global LED packaging industry is primarily concentrated in China, East Asia, the United States, and Europe. In recent years, driven by cost advantages and strong demand for downstream products, China has gradually taken over the global industrial transfer and become the world's largest LED packaging production base.
According to data from the Institute of Advanced Industrial Industries (GGII), the size of China’s LED packaging market increased from RMB 64.4 billion in 2015 to RMB 73.7 billion in 2016, a year-on-year growth of 14%. In 2017, with the recovery of the LED application market, especially the lighting sector, and strong demand in niche markets, GGII projected that the Chinese LED packaging market would reach 87 billion yuan.
As an essential part of the entire LED supply chain, LED packaging materials have faced continuous challenges due to market fluctuations. In particular, LED adhesives have gone through various stages—from price wars to patent battles—experiencing intense market competition.
Qian Xuexing, General Manager of Morning Technology, stated, “This year, the overall glue market is in a growth phase. As major packaging companies expand, the demand for adhesives has increased. However, due to environmental regulations in the second half of the year, many small silica raw material enterprises have shut down, causing a sharp rise in prices at large enterprises. Customers are now required to pay upfront, which puts significant financial pressure on adhesive companies. This situation also presents an opportunity for market reshuffling, as smaller glue companies may struggle, while those with strong brand presence, R&D capabilities, and financial strength can seize new development opportunities.â€
Morning Technology has been actively expanding its product line, focusing on COB and patch adhesives. As a state-level high-tech enterprise, it specializes in the research and development of semiconductor packaging materials, LED packaging materials, and electronic assembly materials. The company holds five invention patents and seven utility model patents.
Initially entering the LED market with SMT solder paste and solid crystal solder paste, Gujing solder paste became a foundational material in the LED field and has remained at the forefront of the industry. After rapid development, the company now dominates more than 80% of the domestic LED flip chip solder paste market and is widely recognized by major LED packaging manufacturers for its high quality and reasonable pricing.
In 2011, after successfully developing solid-state solder paste, Morning Technology identified a growing market for LED packaging rubber. In 2012, during the early stage of COB development, the company launched dam glue. Although dam rubber is a small component of COB packaging, it has captured a large portion of the domestic COB packaging market. This success has given the company confidence in moving forward with silicone gel material development.
To support this, Morning Technology has assembled a team of PhDs and master's degree holders to focus on the development of LED silicone gel. They have successfully launched filament glue, COB glue, and patch glue. According to Qian Xuexing, “Filament glue has passed market quality inspections from 2015 to 2017 and is now recognized by the top three companies in the domestic filament packaging sector, indicating promising future prospects.â€
Although some large-scale enterprises have already entered the COB and patch glue markets, Morning Technology has pursued a strategy of "intensive cultivation," keeping up with technological advancements and maintaining stable quality. Their products offer excellent cost-performance, making them popular among many companies.
The high-power COB glue is a two-component addition silicone encapsulant, suitable for powder mixing and potting of high-power COB or integrated module surface light sources. Its key advantages include:
1. Good leveling and easy injection.
2. After curing, it provides a smooth surface, no bubbles, and excellent bonding performance with PPA, silver-plated brackets, white oil plates, Mirror aluminum, and ceramic substrates.
3. Low expansion coefficient, excellent heat resistance, and no cracking, shrinking, or yellowing even after 300°C long-term aging.
Notably, the high-temperature COB adhesive developed by Morning Technology is comparable to Dow Corning 7340 and performs slightly better in high-temperature environments.
As the saying goes, “Good steel makes good knives,†and the same applies to LED light sources, which require high-quality adhesives. With the rapid development of the LED market, the requirements for high-power COB glue have significantly increased, such as for flip-chip lights and high-power, high-heat applications. New parameters like the melting point of solder paste and high-temperature resistance have emerged, and Morning Technology offers excellent solutions for these needs.
Qian Xuexing emphasized, “We always encourage our engineers to go out and visit customer sites personally to understand their specific needs and solve problems in a direct, peer-to-peer manner. Our service philosophy is that as long as customers have issues, we will do everything possible to resolve them.â€
In terms of continuous R&D and cost reduction, glue plays an important role in LED packaging costs. To reduce packaging costs and lower accessory prices, including glue, has become a crucial way for packaging companies to cut expenses. This has led to shrinking profit margins and increasing survival challenges for glue companies.
Downstream manufacturers have continued to reduce the prices of packaged devices, indicating that besides internal cost management, material costs must be further reduced. The price of ordinary packaged silica gel is inevitable.
Facing market pressures, glue companies are seeking new profit growth areas by shifting toward high-margin products. Many companies have begun to focus on specialized segments such as filament glue, high-temperature COB glue, and high-power (1W or more) 2835 patch glue.
Currently, both COB and patch adhesives represent large-volume markets. “COB includes high-power and low-power variants, and there are differences between aluminum and ceramic substrates, leading to diverse market demands for COB silicone. Our high-power COB adhesive 9318-5 optimizes the customer's ability to replace Dow Corning 7340, meeting cooling and cost reduction requirements,†Qian Xuexing explained.
LED SMD encapsulant is a two-component thermosetting silicone encapsulant used for various types of LED patches. The patch glue uses a unique MDT resin structure design, offering strong adhesion to PPA and aluminum substrate silver plating layers, along with high purity, refractive index, vulcanization resistance, and thermal shock resistance.
Qian Xuexing added, “For spread glue, similar to COB glue, the main concerns of customers are quality stability and cost. Especially in the 2835 market, which is highly competitive, most customers have strict cost demands. As a latecomer, we actively reduce patch glue costs to meet expected customer targets.â€
Looking ahead, Morning Technology aims to enter the top three domestic silicone companies within the next three years. While international giants like Dow Corning and Shin-Etsu once dominated the domestic LED packaging silica gel market, domestic glue companies have made significant progress in recent years, continuously improving technology and capturing market share.
With the rapid growth of the domestic LED lighting market, the demand for adhesives as core packaging materials will also increase. Morning Technology is seizing this opportunity, aiming to re-energize the market and gain more market share.
“We are striving to fully leverage our R&D advantages and point-to-point technical service awareness, based on our leadership in Gujing solder paste, dam glue, and filament glue. We are committed to dominating the COB and patch glue markets, creating value for customers, and aiming to be among the top three in China within three years,†concluded Qian Xuexing.