Recently, Guoxing Optoelectronics (002449) R&D team announced that it has once again made a major breakthrough in the field of high-power LED packaging technology, and successfully developed a mass production eutectic process technology. Application programs are normally developed in the CPU`s RAM memory and executed
from RAM memory. If additional program integrity is desired, or operation of the PLC without
a battery is desired, an optional EEPROM or EPROM can be installed in a spare socket
(labeled PROGRAM PROM) on the Model 311/313 backplane or in a socket on the model
331/341 CPU Module. EEPROMs can be written to and read from. EPROMs can be read
when installed in the PLC; however, they must be written to using an external PROM programming
device.
Following is the procedure for adding or changing the EEPROM or EPROM. For clarity, the
term PROM is used to refer to either an EEPROM or an EPROM.
1. Remove power from the system.
2. If 311/313
Remove all modules, including the power supply.
Remove the plastic cover.
3. If 331/341:
Remove CPU from backplane.
Remove front plate and bezel. Unsnap circuit board and remove from case.
4. If the socket is the type which has a screw near the top edge (some versions of 311/331),
loosen screw at top of PROM socket (CCW twist;).
5. If present, remove old PROM from socket. Replace with or install new PROM. Orient
the PROM so the end with a notch (the top of the prom) is toward the top edge of the
backplane. Pin 1 of the prom is the first pin on the left as you move counter–clockwise
from the notch. On the 311/331, correct installation orients the notch toward the screw.
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The eutectic process is an advanced process technology for eutectic soldering of high-brightness LED chips on a substrate or a support. Instead of the conventional insulating glue or silver paste, the thermal resistance of the device can be reduced and the reliability of the device can be improved. According to the high-tech LED reporter, the eutectic process technology has been mastered by foreign LED companies such as Cree, Lumileds, Osram, etc., and Guoxing Optoelectronics has made breakthroughs in eutectic process technology, once again enhancing the domestic packaging manufacturers in the field of LED packaging technology. Core competitiveness.
The principle of the eutectic process is to use a plurality of metals to melt at a eutectic temperature to form a eutectic alloy, thereby soldering the LED chip to the substrate or the support. Since the beginning of 2011, Guoxing Optoelectronics has invested a large amount of capital, equipment and research and development strength. Through continuous process development and improvement, the eutectic void rate of LED chips has been successfully met to meet the industrialization requirements, and the eutectic quality has reached the international advanced level. High-power LED devices using eutectic process can meet the requirements of more severe use environments, and have broad application space in indoor lighting, outdoor lighting, and automotive lighting. 
X-ray detection results of eutectic layer of LED devices prepared by eutectic process 