Insulated Piercing Connector Clamps are designed for use in 1 kV to 10 kV insulation cable systems. The Piercing Clamps material are made of weather and UV resistant glass fibre reinforcec polymer. The clip mechanical and electrical properties by the Piercing Connector Clamp are a result of high quality materials used to create it. Contact with the blade selects tin bronze alloy or a strong aluminum alloy, Insulation Piercing Clamp ensures the optimal transition of contact area. The waterproof material is made of high quality rubber ring and silica gel of quality properties. Piercing Connector Clamp Piercing Clamps,Insulation Piercing Clamp,Insulated Piercing Connector Clamps,Piercing Connector Clamp FUZHOU SINGREE IMP.& EXP.CO.,LTD. , https://www.cninsulators.com
Recently, some experts have proposed new industrial thinking to improve LED cost and process. Among them, the new technology direction of non-sapphire substrate solution has caused the LED market to be shocked.
Due to cost and electrical considerations, many large manufacturers have begun to use non-sapphire substrate technology to create LEDs. Well-known manufacturers include TSMC SSL, and the combination of Bridgelux and Toshiba. In addition, US equipment giant Veeco is quite optimistic about the progress of Gan-on-Si, and it is expected that 8-inch equipment will be the new focus of the future market. In addition to optimistic about Gan-on-Si, German equipment manufacturer Aixtron also introduced MOCVD equipment to build power supply units with higher temperature processes, which have been purchased and cut into the power supply market. Japanese equipment factory Dayang Risin also launched Gan-on-Si's MOCVD equipment products and highlighted the niche market.
In addition, Cree also introduced LEDs that do not use sapphire substrate technology, and build LEDs based on SiC, demanding high performance. South Korea's LED factory Seoul Semiconductor has introduced the latest nPora technology, which is one of the results of cooperation with the father of Blu-ray LED, Nakamura Shuji. With Gan-on-Gan technology, there are relatively few manufacturers of such Gan substrates, but they have already come out one after another. The size of the goods is more suitable for creating LED chips than traditional sapphire substrates.
In fact, LEDs built on these new non-sapphire substrates are new technologies, so the initial cost should not be effectively reduced. However, such a development direction is basically correct, and the non-sapphire substrate solution is also expected to become the next feasible new path for the LED industry. 
Features
1. The connectors with specially designed contact teeth are suitable for the connetion of aluminum.
2. The teeth grooves of the clamp make the conductors connect the insulation cover functions as waterproof and sealing perfectly
3. At the breaking force of the conductor the connector will not be distorted and broken
4. At the rate current and short circuit rising temperature of the connector should be less than the connecting conductor
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The LED industry has encountered bottlenecks in non-sapphire substrates to improve the new direction of cost?
The high cost of LEDs makes it difficult to reduce the price in the market, which makes LED lighting difficult to spread to the average home. This is the biggest bottleneck in the LED industry. Therefore, the discussion on improving the cost of LEDs has not stopped.