OFweek Semiconductor Lighting Network: Under the global environmental awareness, LED lighting has become one of the major development policies in many countries. In terms of the overall LED lighting market development, LED lighting applications used to be portable lighting, decorative lighting, and indirect lighting. Mainly. The United States is expected to stop using incandescent lamps in 2014, and the world has begun to follow up on this policy. Thanks to the advancement of science and technology, the next generation of lighting technology is about to enter a full-scale period. The LED lighting market is expected to take off quickly in the next 2-3 years. Among them, heat dissipation has always been one of the key technologies. In response to the ban on incandescent lamps in 2012, LED bulb shipments will grow significantly, with an estimated production value of approximately $8 billion, plus subsidies for green products such as LED lighting in North America, Japan, and Korea. Driven by factors such as high-will-willing replacement of LEDs and lighting, such as stores, stores and factories, the global LED lighting market penetration rate will have a chance to exceed 10%. Because of the unlimited potential of LED production, coupled with the conditions of sustainable business, many component manufacturers have seen the explosive power of this emerging market, and actively research related technologies, of which heat dissipation is the most critical. Alumina (Al2O3) substrate (electroplated gold) LED application cooling is a key factor First, from the heat-dissipating materials, there are several material options. Taking the substrate part of the MCPCB as an example, since the MCPCB needs to increase the insulating layer (the ceramic substrate itself is insulated), the thermal expansion coefficient of the insulating material used is too high, when the temperature is too high. Will produce cracks. Relevant discussions also pointed out that the thermal conductive film or the soft thermal conductive gasket can't be really close to the substrate. There are still many pores in the bonding surface. Looking at these pores under an electron microscope is like a hollow gas. The hole is also forming another form of thermal resistance! Under the thermal resistance of so many holes that interfere with heat conduction, the efficiency of heat dissipation and heat conduction is reduced. In contrast, the arrayable package of ceramic materials can be applied to high voltage and high temperature processes, has a good thermal expansion matching coefficient, and is not easily deformed by ceramics, which is the best choice for heat sink substrate. Among the materials, alumina and aluminum nitride are the best choices. The former is a mainstream application of medium-order power (1~3W) because of its low price, good thermal conductivity and high material stability. Aluminum nitride has a higher heat transfer coefficient and is a demand for higher-order power (3W or more). Or there are other replacement materials, I believe this is everyone's favorite. From the packaging consideration point of view, in the first-order LED die package heat sink substrate because of the direct transfer of thermal energy from the die, we will consider using ceramic substrate for optimal heat transfer planning. The second-order multi-LED module circuit board package (COB) considers the lower cost MCPCB because of the large heat dissipation area and the reduced temperature. However, with the application level, it will be found that under the high-power LED lighting and long-term use, MCPCB must take into account more factors, in addition to the current safety regulations in Europe can not pass, but also because of the insulation voltage Not enough, leading to long-term opening and the temperature difference caused by the alternating outdoor cold/hot season, it is easy to turn on and lose the effect, causing the light decay phenomenon to increase, which affects the life of the lamp, the product can not operate and needs maintenance or even compensation, additional waste Human and material resources.
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[Edit: Vessel]