XRX using the advanced technology and equipment , manufacturing the best quality fiber connector for all our customers, It is a kind of insert an extraction connector based on the single core plug and adaptor, which both ends of optical cable have the connector plugs, according to the joint can be classified to type SC,FC,LC,ST,MU,MPO,MTRJ,E2000,and so on ,according to difference of the end face have the type PC,UPC,APC and so on. SC stands for Subscriber Connector- a general purpose push/pull style connector. It is a square, snap-in connector latches with a simple push-pull motion and is keyed.
SC Patch Cord,SC SC Patch Cord,SC Fiber Patch Cable,SC Fiber Cable Chengdu Xinruixin Optical Communication Technology Co.,Ltd , https://www.xrxoptic.com
Talking about the trend of LED lamp cooling technology
The increasing carbon dioxide content in the Earth's atmosphere leads to severe climate deterioration, affecting the ecology of the earth, threatening the survival of mankind, and saving energy and reducing emissions. LED lamps, as an energy-saving lighting tool, have been widely promoted in countries around the world.
At present, LED lights can convert 20% of electric energy into light, and the remaining energy is converted into heat energy and diffused into the surrounding air. If this process is hindered, the temperature of the LED chip will rise, when the temperature of the LED chip reaches a limit. It will cause permanent damage to the LED light, causing the LED lamp to have a light decay and shorten the service life. LED lamp cooling technology has always been the focus of LED lamp manufacturers. Chengdu Chaoyue Optoelectronics has been working hard with domestic LED lamp manufacturers in this regard.
There are several ways to dissipate LED lights:
1. Heat is emitted from the air
2. Heat is exported by Systemcircuitboard
3. Heat is derived from gold wire
4. Heat is derived from the board
5. Heat is derived from the substrate
6. Heat is exported by heat pipe
At present, on-board chips have become mainstream, and technologies such as Eutectic and Flipchip have become popular. The heat generated by LED dies is transmitted to the substrate and the circuit board is very large, and it is also excellent for heat dissipation of LED lamps. The key, in theory, the new system heat dissipation efficiency will be higher than the original method (such as gold wire), because the heat conduction cross-sectional area is greatly increased, but the thermal resistance between the interfaces must also be solved.
Therefore, the LED lamp heat sink substrate came into being. Generally speaking, in order to quickly reduce the temperature of a high temperature object with a small volume and surface area, it is necessary to have a medium which has a large volume and surface area and thermal resistance. Small, high thermal conductivity, with this medium, the heat dissipation effect will be much better, LED light cooling substrate (or also includes external cooling fins) is such a medium.
When the amount of heat that needs to be dissipated is small, the PCB can be used for heat dissipation. When there is more heat to be dissipated, the aluminum substrate can be used for heat dissipation. When more heat needs to be dissipated, then copper The substrate is qualified for the heat dissipation work.
But on the other hand, it is necessary to consider the current and thermal energy channel between the LED die and the substrate, that is, the interface problem, the thermal conductivity of the substrate itself is good, but the poor thermal conductivity between the interface with the LED die is also a no-brainer, plus the high temperature processing is also required. As well as mechanical properties and other requirements, ceramic substrates have become the most promising direction. Silicon substrates, silicon carbide substrates, anodized aluminum substrates, etc. are all being studied by manufacturers, but at this stage, there are still such defects that are difficult to apply in large quantities. At present, the more mature way is thin-film aluminum nitride ceramics, but the price still limits its popularization. As for the active cooling of the fan and the automatic cooling of the electric field, please refer to the relevant literature, this article will not discuss.