In response to the increasing demand for white LED modules centered on lighting applications, Japan ’s IDEC (IDEC) has developed a module (pseudo-white LED module) that combines blue LED components and yellow fluorescent materials to achieve white light. New manufacturing process (Figure 1) * 1. The difference between the new process and the traditional process is that the LED component on the substrate is encapsulated by a resin, and a gel-like silicone resin sheet containing a fluorescent material is pasted on the LED component for heating and encapsulation. Compared with the traditional process, the new process can shorten the time required for the packaging process to 1/9, and can achieve stable quality and simplify equipment. Figure 1: LED module (a) and gel-like resin sheet (b) produced by the new process White light is realized by using a combination of blue LED elements and yellow fluorescent materials. The LED component package uses a gel-like silicone resin sheet (manufactured by Nitto Denko) containing fluorescent materials. Photography: (a) for Edek, (b) for Nitto Denko * 1: The way to realize white light also includes the combination of three primary colors of light-red, green and blue LED elements. However, its use is mostly for the light source of the display. In lighting applications, pseudo-white LED modules are the mainstream. There is no cause of deviation Figure 2 is a comparison between the traditional process and the new process * 2. The conventional process encapsulates the LED element with a liquid resin containing fluorescent materials. First, a "dam" is formed around the LED element on the substrate to block the outflow of resin and harden it. Then, the liquid resin and the fluorescent material are stirred and poured into the dam on the substrate. Finally, the cast resin is thermally hardened. The entire packaging process takes about six hours. Figure 2: Comparison of the traditional process and the new process in the packaging process The traditional process takes about six hours for the entire packaging process (forming and hardening the dam, stirring the resin and fluorescent material, pouring and hardening the liquid resin). The new process only needs to stick the gel-like sheet to the LED element for hardening, so it only takes 40 minutes. Produced by this journal based on Edek's information. * 2: In addition, there is a manufacturing process for encapsulating LED elements with solid resin sheets containing fluorescent materials. The manufacturing process is easy to stabilize the quality, but it cannot be encapsulated by the solid resin sheet alone, and liquid resin is needed for encapsulation, so the production efficiency is low. However, in this manufacturing process, there are many problems that the resin and the fluorescent material are not uniformly mixed, the phosphor is precipitated in the resin, and the amount of the resin poured varies, which will cause unstable quality and it is difficult to maintain the quality. If the quality of the packaging process is not uniform, there will be chromaticity deviation, which may affect the performance of the LED module. The new process is to paste a gel-like resin sheet on the LED element on the substrate and heat it to about 150 ° C. After about 40 minutes, the sheet is hardened to complete the packaging, so the time required can be greatly shortened. In addition, the gel-like resin sheet basically does not cause factors such as precipitation of fluorescent materials, which may cause uneven quality of the packaging process, so the performance as an LED module can be easily improved. For example, with regard to the aforementioned chromaticity deviation, compared with the traditional process, the new process can reduce the deviation to about half. Moreover, the number of processes until packaging is completed is small, so the production equipment can also be simplified. In addition, the new process also improves the thermal cycle characteristics, although Edek originally had no plans for this. When the test was conducted with a cycle of exposure to low temperature (-55 ℃) and high temperature (85 ℃) for 30 minutes as a cycle, it was found that the modules produced by the traditional process began to fail after about 200 cycles, and The modules produced by the process did not fail after more than 2,000 cycles. Gaming mechanical keyboard,Gaming RGB keyboard,gaming keyboard custom,ergonomic gaming keyboard Dongguan Yingxin Technology Co., Ltd. , https://www.yxsparepart.com
