Among many environmentally friendly light source applications, LED is a light source technology that is more energy efficient and easier to assemble than other light source solutions. Among the lighting source applications, high power white LEDs are the most frequent light emitting components, but Although white LEDs have been developed in terms of luminous efficiency and single power performance, in fact, white LEDs still have problems such as uniformity of illumination and lifetime of packaging materials, especially in the application of heat dissipation of chips, which is the first requirement for the development of LED light source applications. Improved problem... High-power white LEDs are used in daily lighting applications. In fact, after environmental protection light sources have received increasing attention, they have become the primary choice for developing environmentally friendly light sources. However, there are still many technical bottlenecks in white LEDs that have yet to be overcome. At present, there are related improvement schemes to enhance the design bottleneck of white LEDs in terms of uniformity of illumination, life of packaging materials, heat dissipation enhancement, etc., and to carry out key functions and performance. Improvement. Environmentally friendly light source demand increases high power white LED application outlet The main reason why LED light source is favored is that it has long product life, high light-to-electric conversion efficiency, and material properties can be embedded in any plane. However, in the development of daily lighting sources, due to the need to achieve practical "lighting" requirements, the original LEDs for indication purposes can not directly correspond to lighting applications, must be strengthened from the chip, package, carrier board, production technology and external circuits. To achieve the high power, high brightness lighting effects required for lighting applications. As for the market demand level, the white LED developed for the lighting application market can be said to be a product with higher usage in the future, but in order to achieve the utility, the white LED must be improved for the lighting application. One is to strengthen the LED chip, for example, to increase its light-to-electric conversion efficiency, or to increase the chip area, so that the luminous amount (light flux) of a single LED reaches its design limit. Secondly, it is a more compromised design. If the size of a single LED chip is continuously difficult, and the multi-chip LED chip is packaged in the same light source module, it is also a practical technical solution that can reach the above method. . Meets low-cost, high-brightness design requirements in a multi-chip package As for the inspection of industrial practice requirements, due to mass production flexibility, design difficulty and control of product yield/cost, LED chips continue to meet the design bottleneck of cost and yield. A glimpse of the design of the chip area may be difficult, not technical and production technology, but in terms of cost and efficiency considerations, large-area LED chips cost higher, and changes to actual manufacturing needs The design flexibility is low. Instead, the integrated packaging method of multiple chips is used to equidistantly arrange a plurality of LED small chips on the carrier board, and the entire package of the optical package materials is connected by wire bonding to form a light source module product, and more The chip package can be integrated into a light source module equivalent to a large chip after secondary chip processing, but it is more flexible in terms of manufacturing flexibility than the single-chip LED light source component. At the same time, the multi-chip LED chip module solution, the production cost can also be greatly reduced due to the cost of the chip, which is equivalent to the lower cost development option under the same luminous flux of the monolithic design. Multi-chip integrated light source module still needs to consider cost maximization Another development direction is to continuously increase the area of ​​the LED chip and obtain high brightness and high luminous flux output through a large area. However, the area of ​​the oversized LED chip may also be less than expected by the design. The common improvement scheme is to modify the structure of the polycrystal to improve the surface of the chip. However, the related improvement scheme also easily affects the heat dissipation efficiency of the chip itself, especially in the light source. Most of the applied LED modules are required to be driven at high power to obtain higher luminous flux, which will cause the high heat collected by the chip junctions during the illuminating process of the chip to be easily dissipated, affecting the application flexibility and main/passive of the module products. Thermal design. In the general design scheme, according to the analysis, the chip size of 7mm2 is adopted, and the luminous efficiency is the best, but the 7mm2 large chip is difficult to control the yield and light performance, and the cost is relatively high; instead, the multi-chip chip is used, such as 4 A piece or 8 pieces of low-power chips are used for secondary processing on the carrier board to form an LED light source module with the package material, which is a design scheme for the LED light source module product capable of rapidly developing the required brightness and power performance. For example, manufacturers of light source products such as Philips, OSRAM, and CREE have introduced LED light source module products that integrate 4, 8 or more small LED chip packages. However, such high-brightness component schemes using multiple LED chip architectures have also caused some design problems. For example, multiple LED chip package packages must be combined with built-in insulation materials to avoid short-circuiting of individual LED chips; such a process is relatively There are many more programs in a single-chip design, so even if you can save costs compared to a single-chip solution, the cost gap between the two solutions can be reduced by the extra insulation process. Application chip surface process improvement can also enhance LED light output In addition to increasing the chip area or number is the most straightforward method, there is another improvement in luminous efficacy for the material properties of the chip itself. For example, an uneven surface structure can be fabricated on the LED sapphire substrate, and the irregular light-designed surface is used to enhance the LED light output, that is, a texture surface crystal structure is established on the surface of the chip. OSRAM has developed this method to develop Thin GaN high-brightness products. The InGaN layer is first formed into a metal film material, and then the stripping process is performed, so that the surface after peeling can indirectly obtain higher light output! OSRAM claims that this technology can make the same The chip achieved 75% light extraction efficiency. On the other hand, the development thinking of OMRON in Japan is quite different. The same is the light extraction efficiency of the chip. OMRON attempts to use the planar light source technology to reflect, guide and control the chip light source with LENS optical system. The light loss problem common to LED products of type package structure further improves the design structure, and uses the double-layer reflection effect to control and enhance the light extraction amount of the LED. However, this packaging technology is relatively more complicated and costly, so most of them are only used. Designed for LCD TV backlight modules. LED lighting applications still need to improve component light decay and lifetime issues If you expect LED light source to be imported into daily lighting applications, the application will have to overcome more problems! Because the daily lighting source will have a long-term use situation, it will often last for several hours or even tens of hours when it is turned on. The time-on LED will cause the luminescence attenuation and life reduction of the chip due to the high heat of the component. The component must propose a better solution for the heat treatment, so as to slow the premature occurrence of the light fading problem and affect the product experience. Another major problem with the introduction of LED light sources into everyday applications is that, for conventionally used fluorescent lamps, the same luminous efficiency can be maintained for more than tens of hours, but the LEDs are different. Because the LED light-emitting chip will have a decreasing luminous efficiency due to the high heat of the component, and this problem is common to both high-power and low-power LEDs, but only low-power LEDs are used only for indicative purposes, and the impact on the user is rather small. However, if the LED is used as a light source, the problem of decreasing the light output will increase the driving power of the single component to increase the brightness. Generally, the brightness will decrease after a few hours of use, and the heat dissipation design must be improved to achieve the light source. Application requirements. LED packaging materials need to be improved in response to high temperature and short wavelength light In the light source design scheme, the driving current is often used in exchange for the higher light output of the LED chip, but this will increase the heat generated by the surface of the chip during the illuminating process, and the high temperature of the chip tests the durability of the packaging material continuously. When the high temperature is applied, the original packaging material with high thermal durability will be deteriorated, and the deterioration or qualitative change of the material will further cause the transmittance to decline. Therefore, when developing the LED light source module, it is necessary to change the packaging material to a high degree. Heat resistant material. There are quite a few methods for increasing the heat dissipation of LED light source module components, which can be improved from chips, packaging materials, thermal conduction structures of modules, and PCB carrier design. For example, if the heat transfer rate between the chip and the package material is enhanced, it is also a method to quickly dissipate the core heat source through the surface of the package material. Or the contact between the chip and the carrier board directly dissipates the direct conduction heat source of the chip core high heat transmissive material to the carrier board, and the key improvement of the LED chip high heat is performed. In addition, the PCB adopts the metal material and the LED chip is closely attached to the assembly design, and can also achieve the design goal of quickly dissipating the high heat of the core of the light-emitting component because the heat resistance of the heat conduction is reduced. In terms of packaging materials, in the past, most of the LED components were encapsulated with epoxy resin. In fact, the heat resistance of the epoxy resin itself is not high, and the epoxy resin has been heated for a long time before the end of the service life of the LED chip. Deterioration and deterioration of discoloration during operation. In the LED module design of lighting applications, the speed of deterioration of the packaging material is accelerated due to the high power driving of the chip, and even the safety of the component is affected. Not only the high heat problem, the plastic material such as epoxy resin has high sensitivity to light, especially the short-wavelength light will cause the epoxy resin material to be damaged, and the high-power LED light source module has short-wavelength light. There will be more, and the rate of deterioration of materials will also increase. For the LED light source application design, most of the manufacturers tend to abandon the epoxy resin packaging materials, and use the packaging materials that are more resistant to high temperature and short-wavelength light. For example, the resin has higher heat resistance than the epoxy resin, and In terms of material properties, tantalum resin can achieve the advantages of materials that do not change color when exposed to 150 to 180 °C. In addition, the ruthenium resin can also disperse blue light and ultraviolet light. The ruthenium resin can suppress the deterioration of the material of the package material due to high heat or short-wavelength light, and slow down the problem of the light transmittance falling due to deterioration of the package material. For the LED light source module, tantalum resin also has the advantage of prolonging the service life of the LED component. Because the tantalum resin itself has the advantages of high heat resistance and short-wavelength light resistance, the sealing material can resist the continuous high heat and light irradiation caused by the long-term use of the LED. The life span is relatively long, and LED components can have a service life of more than 40,000 hours. Edit: Nizi
ZGAR PCC
ZGAR electronic cigarette uses high-tech R&D, food grade disposable pod device and high-quality raw material. All package designs are Original IP. Our designer team is from Hong Kong. We have very high requirements for product quality, flavors taste and packaging design. The E-liquid is imported, materials are food grade, and assembly plant is medical-grade dust-free workshops.
From production to packaging, the whole system of tracking, efficient and orderly process, achieving daily efficient output. We pay attention to the details of each process control. The first class dust-free production workshop has passed the GMP food and drug production standard certification, ensuring quality and safety. We choose the products with a traceability system, which can not only effectively track and trace all kinds of data, but also ensure good product quality.
We offer best price, high quality Vape Device, E-Cigarette Vape Pen, Disposable Device Vape,Vape Pen Atomizer, Electronic cigarette to all over the world.
Much Better Vaping Experience!
ZGAR PCC E-Cigarette Vape Pen,ZGAR PCC Device Vape,ZGAR PCC Vape Pen Atomizer,Latest Disposable E-Cigarette OEM vape pen,ZGAR PCC electronic cigarette Zgar International (M) SDN BHD , https://www.oemvape-pen.com
