Philips LCD TV 40PFL5449/T3 does not boot for MSD6A608 BGA chip - android - Phones Developers

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Philips LCD TV 40PFL5449/T3 does not boot three no, the indicator light does not light, check the motherboard power supply 1.5V 1.2V 3.3V 5V, etc. all normal, update the FLASH program is useless, use the PC connection did not find the print information, replace the 24M crystal, or No use, and finally only suspected CPU damage, but the cpu of this machine is packaged in BGA, because there is no such chip soldered again, the Internet must be checked with a special BGA rework station, but also saw it. The example of successful welding with a wind gun by a master, as well as the BGA rework station without 2000 or more, is not enough. If you want to go, you should try it with the soil method, that is, use the air gun and the preheating station.
Remove the BGA chip: Firstly, it must be welded in the indoor airless environment. Place aluminum foil around the chip to prevent high temperature from damaging nearby components. Turn on the preheating station and set it to 190 degrees. Place the PCB on top and bake. 10 minutes or so, to prevent the water inside the PCB board from deforming. After 10 minutes, the temperature of the preheating station is also stable. The temperature of the 850 air gun is screwed to 380 degrees, the air volume is between 4-5, and the nozzle is about 20 mm away from the BGA chip. Do circular motion around the chip. After about 15 seconds, use a sharp tweezers to touch the chip. If you can push it left and right, it means that the solder beads under the chip melted. Of course, the heat gun can not stop, the chip can be stopped. After the movement, the chip can be taken down and the preheating station is turned off.
Clean the pads on the PCB: use a tin wire and a knife-type soldering iron to clean the tin on the board pad, and then carefully clean it with alcohol. Make sure that the pad is flat and free of debris. (This is very important) Take a closer look with a 50x magnifying glass and apply a thin layer of solder paste to the pad.
Soldering: Take the BGA chip that has been implanted with beads, and apply a layer of solder paste on the new chip. Align the printed wire frame, pay attention to the position of the 1 foot, align, turn on the preheating station, and wait for the temperature to reach 190. At the time, the wind gun is about 20mm from the chip to make a circular motion around the chip. It can be welded in about 30 seconds. After the welding, the preheating station power supply is turned off, and the board can be put on the machine after it has cooled down.
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BGA chip should be attached to the aluminum foil paper

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